PART |
Description |
Maker |
M6MGT331S8BKT M6MGB331S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位个M × 8 2米x 16位).0伏的CMOS只,同时 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位4个M × 8 2米x 16位).0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装(MCP / XIP)的快闪记忆体,数据存储的MirrorBit闪存和移动存储芯片(XIP)的 Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位)的CMOS 3.0伏特,只有页面模式闪存数据存28兆位米16位)的CMOS
|
Spansion Inc. Spansion, Inc.
|
AM45DL32X8G AM45DL3238GB85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
ADVANCED MICRO DEVICES INC
|
S71PL129JC0_06 S71PL129JA0 S71PL129JB0 S71PL129JC0 |
Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM 128 Megabit (8M x 16-bit) CMOS3.0 Volt-only Simultaneous Operation, Page Mode Flash Memory
|
SPANSION[SPANSION]
|
DS42514 |
MCP Flash Memory and SRAM
|
Advanced Micro Devices
|
AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc.
|
M36W0R6050B3 M36W0R6050B3ZAQE M36W0R6050B3ZAQF M36 |
SPECIALTY MEMORY CIRCUIT, PBGA107 64-Mbit (4 Mbits 隆驴16, multiple bank, burst) Flash memory and 16-Mbit (1 Mbit 隆驴16) or 32-Mbit (2 Mbits x16) PSRAM MCP 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package 64-Mbit (4 Mbits 】16, multiple bank, burst) Flash memory and 16-Mbit (1 Mbit 】16) or 32-Mbit (2 Mbits x16) PSRAM MCP
|
Numonyx B.V
|
A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAMA82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位4Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行
|
AMIC Technology, Corp. AMIC Technology Corporation
|
S71GL064N |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
SPANSION
|